Effect of Sb Addition on the Solidification of Deeply Undercooled Ag-28.1 wt. % Cu Eutectic Alloy

نویسندگان

  • Su Zhao
  • Yunxia Chen
  • Donglai Wei
  • Hugo F. Lopez
چکیده

Ag-28.1 wt. % Cu eutectic alloy solidifies in the form of eutectic dendrite at undercooling above 76 K. The remelting and ripening of the original lamellar eutectics result in the formation of the anomalous eutectics in the final microstructure. The addition of the third element Sb (0.5 and 1 wt. %) does not change the growth mode, but enlarges the volume fraction of anomalous eutectics because of the increasing recalescence rate. The additional constitutional supercooling owing to the Sb enrichment ahead of the eutectic interface promotes the branching of the interface and as a result fine lamellar eutectic arms form around the anomalous eutectics in the Sb-added Ag-28.1 wt. % Cu eutectic alloy.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

EFFECT OF COOLING RATE AND GRAIN REFINEMENT ON THE MICROSEGREGATION IN Al-4.8 wt.% Cu ALLOY

 Microsegregation is one of the most important phenomena occurs during solidification. It usually results in formation of some unexpected second phases which generally affect the mechanical properties and specially reduce the workability of casting products. The aim of this research is to study the effect of cooling rate and grain refinement on the microsegregation in Al-4.8 wt.% Cu. For this p...

متن کامل

Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 C, ...

متن کامل

Low-Temperature Interface Reaction between Titanium and the Eutectic Silver-Copper Brazing Alloy

Reaction zones formed at 790 °C between solid titanium and liquid Ag-Cu eutectic alloys (pure and Ti-saturated) have been characterized. When pure Ag-Cu eutectic alloy with 40 at.% Cu is used, the interface reaction layer sequence is: αTi / Ti2Cu / TiCu / Ti3Cu4 / TiCu4 / L. Because of the fast dissolution rate of Ti in the alloy, the reaction zone remains very thin (3-6 μm) whatever the reacti...

متن کامل

The Solidification Behavior of AA2618 Aluminum Alloy and the Influence of Cooling Rate

In AA2618 aluminum alloy, the iron- and nickel-rich intermetallics formed during solidification are of great effect on the mechanical properties of the alloy at both room temperature and elevated temperatures. However, the solidification behavior of the alloy and the formation mechanism of the intermetallics during solidification of the alloy are not clear. This research fills the gap and contr...

متن کامل

Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy

The goal of the present work is to investigate the effects of the addition of Sb (0, 3 and 6 wt%) on structure, melting, corrosion and mechanical properties of Sn-Bi eutectic solder alloys. The mechanical properties of the bulk Sn-Bi-Sb solders were higher as the amount of antimony increases, making compressive strength augment from 65 MPa to 100 MPa when 6 wt% Sb was incorporated to the Sn-Bi ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2016